HCD-DX30/RG40
SERVICE MANUAL
US Model
Canadian Model
Ver 1.0 2001. 05
AEP Model
HCD-RG40
E Model
Australian Model
HCD-DX30
• HCD-DX30/RG40 is the tuner,
deck, CD and amplifier section in
MHC-DX30/RG40.
Photo : HCD-DX30
Model Name Using Similar Mechanism
CD Mechanism Type
NEW
CD
CDM58B-K6BD38
BU-K2BD38
KSM-213DCP
Section
Base Unit Name
Optical Pick-up Name
Tape deck
Section
Model Name Using Similar Mechanism
NEW
SPECIFICATIONS
Other models:
CD player section
AUDIO POWER SPECIFICATIONS:
(HCD-RG40 USA models only)
System
Compact disc and digital
audio system
HCD-DX30
The following measured at AC 120, 220, 240 V
50/60 Hz
DIN power output (rated) 100 + 100 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
120 + 120 watts (6 ohms
POWER OUTPUT AND TOTAL
HARMONIC DISTORTION:
Laser
Semiconductor laser
(λ=780 nm)
Emission duration:
continuous
with 6 ohm loads both channels driven, from
120 – 10,000 Hz; rates 100 watts per channel
minimum RMS power, with no more than 10%
total harmonic distortion from 250 milliwatts to
rated output.
Laser output
Max. 44.6 µW*
*This output is the value
measured at a distance of
200 mm from the
at 1 kHz, 10% THD)
Inputs
MD/VIDEO (AUDIO) IN (phono jacks):
voltage 450/250 mV,
impedance 47 kilohms
GAME (AUDIO) IN (phono jack):
voltage 450 mV,
objective lens surface on
the Optical Pick-up Block
with 7 mm aperture.
2 Hz – 20 kHz ( 0.5 dB)
780 – 790 nm
More than 90 dB
More than 90 dB
Total harmonic distortion less than 0.07%
(6 ohms at 1 kHz, 50 W)
Frequency response
Wavelength
Signal-to-noise ratio
Dynamic range
Amplifier section
US, Canadian models:
HCD-RG40
Continuous RMS power output (reference)
100 + 100 watts (6 ohms
at 1 kHz, 10% THD)
Total harmonic distortion less than 0.07%
(6 ohms at 1 kHz, 50 W)
impedance 47 kilohms
sensitivity 1 mV,
impedance 10 kilohms
MIC (mini jack):
Outputs
PHONES (stereo mini jack):
accepts headphones of
8 ohms or more
FRONT SPEAKER: accepts impedance of 6 to
16 ohms
SURROUND SPEAKER (MHC-RG60 only):
accepts impedance of 6 to
CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wavelength
Output Level
660 nm
–18 dBm
AEP models:
HCD-RG40
DIN power output (rated) 65 + 65 watts
(6 ohms at 1 kHz, DIN)
16 ohms
Continuous RMS power output (reference)
80 + 80 watts (6 ohms at
1 kHz, 10% THD)
— Continued on next page —
Music power output (reference)
160 + 160 watts (6 ohms
at 1 kHz, 10% THD)
COMPACT DISC DECK RECEIVER
9-873-149-01
2001E1600-1
© 2001.5
Sony Corporation
Home Audio Company
Shinagawa Tec Service Manual Production Group
HCD-DX30/RG40
TABLE OF CONTENTS
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
1. SERVICE NOTE ······························································· 4
2. GENERAL ·········································································· 5
3. DISASSEMBLY ································································ 7
4. TEST MODE ···································································· 12
5. ELECTRICAL ADJUSTMENTS ······························· 16
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
6. DIAGRAMS······································································ 19
6-1. Circuit Board Location ················································ 20
6-2. Block Diagrams Tuner/CD Section ···························· 21
Main Section ······························································· 22
6-3. Schematic Diagram Main Section (1/4) ···················· 23
6-4. Schematic Diagram Main Section (2/4) ···················· 24
6-5. Schematic Diagram Main Section (3/4) ···················· 25
6-6. Schematic Diagram Main Section (4/4) ···················· 26
6-7. Printed Wiring Board Main Section ·························· 27
6-8. Printed Wiring Board BD Section ····························· 28
6-9. Schematic Diagram BD Section ································ 29
6-10.Printed Wiring Board Power AMP Section ··············· 30
6-11.Schematic Diagram Power AMP Section ·················· 31
6-12.Printed Wiring Board Panel Section ·························· 32
6-13.Schematic Diagram Panel Section ···························· 33
6-14.Printed Wiring Board Key Section ···························· 34
6-15.Schematic Diagram Key Section ······························· 35
6-16.Printed Wiring Board Driver Section ························ 36
6-17.Schematic Diagram Driver Section ··························· 37
6-18.Printed Wiring Board Trans Section ·························· 38
6-19.Schematic Diagram Trans Section ···························· 39
6-20.IC Pin Function Description ········································ 40
6-21.IC Block Diagrams ······················································ 42
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
7. EXPLODED VIEWS
7-1. Main Section ······························································· 45
7-2. Front Panel Section ····················································· 46
7-3. Main Board Section ····················································· 47
7-4. CD Mechanism Deck Section ····································· 48
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
8. ELECTRICAL PARTS LIST ······································· 49
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
MODEL IDENTIFICATION
— BACK PANEL —
PARTS No.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
MODEL
AR, E, E51, SP models
AUS, KR, MX, TH models
PARTS No.
4-234-091-1s
4-234-091-7s
• Abbreviation
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